Modulus Specification: | YXF-HDF13850-ZLX-70-180 |
OMNIBUS Size: | 17.5mm * 14mm * 70mm |
OMNIBUS faces: | YXF |
Visum Anglus: | 188° |
Arx Longitudo (EFL); | / |
Apertura (F / NO) | / |
Distortio: | / |
Chip Type: | OV13850 |
Chip faces: | OmniVision |
Interface Type: | MIPI |
Active ordinata Location: | 13000,000 elementa 1280*804 |
Lens Size: | 1/3.06 inch |
Core Voltage (DVDD) | 1.5V±10% (cum embedded 1.5 V ordinator) |
Analogia circuli intentionis (AVDD) | 2.6 ~ 3.0V |
Interface Circuit Voltage (DOVDD) (I/O) | 1.7V ad 3.0V |
OMNIBUS PDF | Contact us sis. |
Chip PDF | Contact us sis. |
Locus originis | China |
Sensor | OV13850 |
Notam nomen | HJ |
Pixel | 13Mega Pixel |
Plurimum elementa | 4224*3116 |
Dirigentes dolor | 0.3m → ∞ |
Genus interface | MIPI |
output formats | X frenum RGB INCOCTUS |
Pixel Size | 1.12 µm x 1.12 µm |
Lens magnitudine | 1/3.06'' |
Temperatus (Operation) | -30°C ad 85°C confluentes temperatus |
Module CMOS Camerae valde compactae magnitudinis et late applicatae in telephono Mobile, Camera tamen Digital, DV, PDA/Handheld, Voy, PC Camera, Camera Securitatis, Camera Automotiva, etc.