Modulus Specification: | YXF-HDF0308-A50-166 |
OMNIBUS Size: | 8mm* 8mm*49.7mm |
OMNIBUS faces: | YXF |
Visum Anglus: | 166° |
Arx Longitudo (EFL); | 1.7MM |
Apertura (F / NO) | TBD |
Distortio: | <-85.32% |
Chip Type: | GC0308 |
Chip faces: | GALAXYCORE |
Interface Type: | DVP |
Active ordinata Location: | 300,000 elementa 648* 488 |
Lens Size: | 1/6.5 inch |
Core Voltage (DVDD) | NC |
Analogia circuli intentionis (AVDD) | NC |
Interface Circuit Voltage (DOVDD) (I/O) | 2.8V |
OMNIBUS PDF | Contact us sis. |
Chip PDF | Contact us sis. |
Genera habemus modulorum. Activa electronicarum partium (Integrated Circuitus, Nullam, Sensores, etc.) ac passiva electronicarum partium (filter, Magnetica Bead. Diodes, Transistores, Capacitores, Resistores, Inductores, et etc.