Modulus Specification: | YXF-HDF13850-MIPI1-70AF-V1 |
OMNIBUS Size: | 8.5mm * 8.5mm * 21mm |
OMNIBUS faces: | YXF |
Visum Anglus: | 70° |
Arx Longitudo (EFL); | 4.6MM |
Apertura (F / NO) | 3 |
Distortio: | <1% |
Chip Type: | OV13850 |
Chip faces: | OmniVision |
Interface Type: | MIPI |
Active ordinata Location: | 13000,000 elementa 4224*3136 |
Lens Size: | 1/3.06 inch |
Core Voltage (DVDD) | 1.2V±5% (with embedded 1.5 V ordinator) |
Analogia circuli intentionis (AVDD) | 2.6 ~ 3.0V |
Interface Circuit Voltage (DOVDD) (I/O) | 1.7V ad 3.0V |
OMNIBUS PDF | Contact us sis. |
Chip PDF | Contact us sis. |
GC0308,GC2035,GC2145,OV7251,OV7670,OV7675,OV7725,OV7740,OV9281, OV9712, OV9732, OV9655, OV9650, OV9653, OV9734
PB
OV13850, IMX135, IMX219, IMX214, AR0103, AR0237,AR0238,AR0330,ASX340CS,MT9V034,NT99141 IMX385 IMX226 IMX482 OV5647cameras.
Please contact and look forward to cooperation with you.
1/3.06" color CMOS 13.2 megapixel (4224 x 3136) imago sensoris cum technologia OmniBSI-3TM
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Trademark Information
OmniVision and OmniVision logo are registered trademark of OmniVision Technologies, Inc. OmniBSI-3 is a trademark of OmniVision Technologies, Inc.
Cetera negotiationes in hoc usu sunt propriae proprietatis possessorum.
applications cellular phones
PC multimedia tabulae
Features
μm x 1.12 μm pixel cum OmniBSI-3TM
technologia
EIS 1080p (2112x1188), EIS 720p (1408x792), et plura
mechanica Lorem)
clavem speciem (typicam)
analog: 2.6 ~ 3.0V (2.8V nominalis) core: 1.14 ~ 1.26V (1.2V nominalis) I/O: 1.7 ~ 3.0V (1.8V vel 2.8V nominalis)
standby: 300μW XSHUTDOWN: 1μW
operans: -30°C ad 85°C coniunctas caliditas stabilis imaginis: 0°C ad 60°C commissuras temperatus
μm x 1.12 μm
μm x 3678.3 μm
μm x 5517 μm (COB);
6260 μm x 5567 μm (RW) (vide sectionem 8 ad singula)