Specifications | |
attributum | Precium |
Fabrica: | Winbond |
Product Category: | NEC Flash |
RoHS: | Singula |
Adscendens Style: | SMD/SMT |
Sarcina / Case: | SOIC-8 |
Series: | W25Q64JV |
Memoria Location: | 64 Mbit |
Supple intentione - Min: | 2.7 V |
Supple intentione - Max: | 3.6 V |
Active Read Current - Max: | 25 mA |
Interface Type: | SPI |
Maximum Horologium Frequency: | 133 MHz |
Organization: | 8 M x 8 |
Data Bus Latitudo: | 8 bit |
Leo Type: | Synchroni |
Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 85 C |
Packaging: | Tray |
Notam: | Winbond |
Supple Current - Max: | 25 mA |
Humor Sensitivus: | Ita |
Product Type: | NEC Flash |
Factory Pack Quantity: | 630 |
Subcategoria: | Memoria & Data PRAECLUSIO |
Nomen: | SpiFlash |
Unitas pondus: | 0.00782 oz |
Features:
* Nova Familia SpiFlash Memoriarum - W25Q64JV: 64M-bit / 8M-byte
- Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1
- Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 - Software & Hardware Reset(1)
* Summa euismod Serial Flash
- 133MHz Singulus, Dual/Quad SPI horologiorum
266/532MHz aequivalens Dual/Quad SPI
- Min.100K Program-rase circuitus per sector - Plus quam XX annos data retentione
* Efficiens "Continuus Read"
- Continua Read cum 8/16/32/64-Byte AMICTORIUM - cum paucis ad VIII horologiorum ad electronica memoria
- Permittit verum XIP (faciam in loco) operandi - Outperforms X16 Parallel Flash
* Low Power, Lata Temperature Range – Single 2.7 to 3.6V supply
- <1μA Power-descendit (typ.)
- -40°C ad +85°C operating range
* Architectura flexibilia cum 4KB sectores
- Uniform Sector/Block Erase (4K/32K/64K-Byte) - Programma 1 ad 256 byte per programmabilem paginam - Erase/Programma suspende & Resume
* Securitatis Features Advanced
- Software and Hardware Write-Protect
- Special OTP praesidium (1)
- Top / Bottom, Complementum ordinata tutela - Individual Clausus / Sector ordinata tutela
- LXIV-bit Unique id pro se fabrica
- Discoverable Parametri (SFDP) Register - 3X256-Bytes Securitatis Registers
- Volatile & Non volatile Status Register Bits
* Space Efficiens Packaging
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-codex WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-pin SOIC 300-mil
- 8-pin PDIP 300-mil
- 24-pila TFBGA 8x6-mm (6x4 pila ordinata)
- 24-pila TFBGA 8x6-mm (6x4/5x5 pila ordinata)
- Contactus Winbond pro KGD et alia bene